Product introduction:
Laser marking technology is one of the largest application fields of laser processing. Laser marking is a marking method or cutting method that uses high-energy density laser to locally irradiate the workpiece to vaporize the surface material or change the color of the chemical reaction, so as to leave a permanent mark. Laser marking can print all kinds of characters, symbols and patterns, and the character size can range from millimeter to micron, which is of special significance to the anti-counterfeiting of products
Model features:
1. It can process most metal or non-metal materials
2. Laser is processed with non mechanical "tools", which does not produce mechanical extrusion or mechanical stress on materials, no "tool" wear, non-toxic and rarely cause environmental pollution
3. The laser beam is very thin, so that the consumption of processed materials is very small
4. During processing, it does not produce X-rays like electron beam bombardment and other processing methods, and will not be disturbed by electric field and magnetic field
5. It is easy to operate, can realize automatic machining by using microcomputer numerical control technology, can be used for high-efficiency machining of parts on the production line, and can be used as a part of the flexible machining system
6. Fine micromachining can be carried out by using precision worktable
7. The micro system or camera system can be used to observe or monitor the condition of the machined surface
8. The internal parts can be processed through transparent materials (such as quartz and glass)
9. The prism and reflection system can be used to gather the light beam on the inner surface or inclined surface of the workpiece for processing
10. It can mark bar codes, numbers, characters, patterns and other signs
11. The line width of these signs can be as small as 20 μ m. The line depth can be less than 10mm, so the surface of parts with "good density" size can be marked.
Application Industry:
3C electronics, auto parts, electrical appliances, plastic shell, aerospace, food packaging, product manufacturing, etc