It can be applied to PCD, PCBN, CVD, ceramic, gem, silicon and diamond industry
Customer Service Hotline
Fax :+86-021-57891301
Tel :+86-15901891893
Product features
● Equipped with high power laser, PCD can be cut under the thickness of 10mm, high beam quality, small divergence angle, can cut more thick materials and fine kerf, to ensure the reliability of cutting quality.
● High precision motion platform: the base of the machine adopts marble, and the motion part adopts linear motor structure, which has high accuracy and good stability. The compact structure can realize short stroke high frequency and high speed movement, and solves the problems of rigid rigidity, empty return and dead zone existing in the traditional servo motor and ball screw rod structure.
● Automatic compensation of Z axis dynamic focusing for laser cutting head.
● Using professional cutting software, laser energy can be adjusted and controlled in software.
● The types of lasers are YAG, green and UV lasers, which can meet the needs of customers.
設(shè)備型號/Model | SG-20 |
激光功率/laser power | 20W(可選/Optional) |
激光波長/Wavelength | 532nm(可定制/Customizable) |
光束質(zhì)量/Beam quality | M2<1.3 |
控制方式/control mode | 西門子PLC、PC軟件/SIEMENS PLC、PC |
聚焦方式/Focusing mode | 單點(diǎn)聚焦鏡/Single point focusing mirror |
運(yùn)動(dòng)軸數(shù)/Number of moving axes | X,Y, Z軸;最多6軸/X, Y, Z axis; at most 6 axes |
運(yùn)動(dòng)平臺重復(fù)精度/repeatability accuracy | ≤±1μm |
運(yùn)動(dòng)平臺定位精度/Positioning accuracy | ≤±3μm |
切割方式/Cutting mode | Z軸動(dòng)態(tài)調(diào)焦自動(dòng)補(bǔ)償/Automatic compensation of Z axis dynamic focusing |
切割縫寬/Width of cutting seam | 0.1~0.12mm |
工作溫度/working temperature | 溫度:10℃~40℃濕度:5%~95%/Temperature: 10 ~40,humidity: 5%~95% |
冷卻方式/Cooling method | 水冷/water cooling |
電力需求/Power demand | 單相/Single-phase:AC220(±10%)/50~60Hz、15A |
總功率/Total power | <1000W |
整機(jī)重量/Weight | 700Kg |
設(shè)備型號/Model | SG-20 |
激光功率/laser power | 20W(可選/Optional) |
激光波長/Wavelength | 532nm(可定制/Customizable) |
光束質(zhì)量/Beam quality | M2<1.3 |
控制方式/control mode | 西門子PLC、PC軟件/SIEMENS PLC、PC |
聚焦方式/Focusing mode | 單點(diǎn)聚焦鏡/Single point focusing mirror |
運(yùn)動(dòng)軸數(shù)/Number of moving axes | X,Y, Z軸;最多6軸/X, Y, Z axis; at most 6 axes |
運(yùn)動(dòng)平臺重復(fù)精度/repeatability accuracy | ≤±1μm |
運(yùn)動(dòng)平臺定位精度/Positioning accuracy | ≤±3μm |
切割方式/Cutting mode | Z軸動(dòng)態(tài)調(diào)焦自動(dòng)補(bǔ)償/Automatic compensation of Z axis dynamic focusing |
切割縫寬/Width of cutting seam | 0.1~0.12mm |
工作溫度/working temperature | 溫度:10℃~40℃濕度:5%~95%/Temperature: 10 ~40,humidity: 5%~95% |
冷卻方式/Cooling method | 水冷/water cooling |
電力需求/Power demand | 單相/Single-phase:AC220(±10%)/50~60Hz、15A |
總功率/Total power | <1000W |
整機(jī)重量/Weight | 700Kg |