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Diamond laser cutting machine

Product application

It can be applied to PCD, PCBN, CVD, ceramic, gem, silicon and diamond industry

Customer Service Hotline

+86-021-3700 9238

Fax :+86-021-57891301

Tel :+86-15901891893

Product introduction Technical parameter Sample display

Product features

● Equipped with high power laser, PCD can be cut under the thickness of 10mm, high beam quality, small divergence angle, can cut more thick materials and fine kerf, to ensure the reliability of cutting quality.

● High precision motion platform: the base of the machine adopts marble, and the motion part adopts linear motor structure, which has high accuracy and good stability. The compact structure can realize short stroke high frequency and high speed movement, and solves the problems of rigid rigidity, empty return and dead zone existing in the traditional servo motor and ball screw rod structure.

● Automatic compensation of Z axis dynamic focusing for laser cutting head.

● Using professional cutting software, laser energy can be adjusted and controlled in software.

● The types of lasers are YAG, green and UV lasers, which can meet the needs of customers.


{"zh":"
設(shè)備型號/Model SG-20
激光功率/laser power 20W(可選/Optional)
激光波長/Wavelength 532nm(可定制/Customizable)
光束質(zhì)量/Beam quality M2<1.3
控制方式/control mode 西門子PLC、PC軟件/SIEMENS PLC、PC
聚焦方式/Focusing mode 單點(diǎn)聚焦鏡/Single point focusing mirror
運(yùn)動(dòng)軸數(shù)/Number of moving axes X,Y, Z軸;最多6軸/X, Y, Z axis; at most 6 axes
運(yùn)動(dòng)平臺重復(fù)精度/repeatability accuracy ≤±1μm
運(yùn)動(dòng)平臺定位精度/Positioning accuracy ≤±3μm
切割方式/Cutting mode Z軸動(dòng)態(tài)調(diào)焦自動(dòng)補(bǔ)償/Automatic compensation of Z axis dynamic focusing
切割縫寬/Width of cutting seam 0.1~0.12mm
工作溫度/working temperature 溫度:10℃~40℃濕度:5%~95%/Temperature: 10 ~40,humidity: 5%~95%
冷卻方式/Cooling method 水冷/water cooling
電力需求/Power demand 單相/Single-phase:AC220(±10%)/50~60Hz、15A
總功率/Total power <1000W
整機(jī)重量/Weight 700Kg
","en":"
設(shè)備型號/Model SG-20
激光功率/laser power 20W(可選/Optional)
激光波長/Wavelength 532nm(可定制/Customizable)
光束質(zhì)量/Beam quality M2<1.3
控制方式/control mode 西門子PLC、PC軟件/SIEMENS PLC、PC
聚焦方式/Focusing mode 單點(diǎn)聚焦鏡/Single point focusing mirror
運(yùn)動(dòng)軸數(shù)/Number of moving axes X,Y, Z軸;最多6軸/X, Y, Z axis; at most 6 axes
運(yùn)動(dòng)平臺重復(fù)精度/repeatability accuracy ≤±1μm
運(yùn)動(dòng)平臺定位精度/Positioning accuracy ≤±3μm
切割方式/Cutting mode Z軸動(dòng)態(tài)調(diào)焦自動(dòng)補(bǔ)償/Automatic compensation of Z axis dynamic focusing
切割縫寬/Width of cutting seam 0.1~0.12mm
工作溫度/working temperature 溫度:10℃~40℃濕度:5%~95%/Temperature: 10 ~40,humidity: 5%~95%
冷卻方式/Cooling method 水冷/water cooling
電力需求/Power demand 單相/Single-phase:AC220(±10%)/50~60Hz、15A
總功率/Total power <1000W
整機(jī)重量/Weight 700Kg
"}
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